Reworkable thermosetting resin compositions
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 4, 2005
app pub date -
Jul 9, 2001
filing date -
Jun 9, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA/LGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA/LGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.
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