Interconnect apparatus, system, and method
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United States of America Patent
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N/A
Issued Date -
Aug 4, 2005
app pub date -
Jan 30, 2004
filing date -
Jan 30, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus, system, and method for forming a connector including a frame, a conductor, and a solder ball formed on a conductive land of the conductor. The method includes depositing solder mask on a conductive pad of a conductor, depositing solder paste in the area defined by the solder mask, and forming a solder ball by reflowing the solder paste. The system includes a first component including a first contact pad, a second component including a second contact pad thereon, and a connector that includes a frame, a conductor including electrically continuous first and second portions, the first portion extending outwardly from the first side of the frame and terminating in a tip in electrical communication with the first contact pad, the second portion extending through the second side of the frame and terminating in a land in electrical communication with the second contact pad, and a solder ball formed on the land.
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