Integrated circuit package with transparent encapsulant and method for making thereof
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United States of America Patent
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Issued Date -
Aug 4, 2005
app pub date -
Dec 29, 2004
filing date -
Dec 31, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
IC package with transparent encapsulant and method for making thereof. The IC package includes a die pad including a pad bottom surface, a die disposed on the die pad and including an integrated circuit, a plurality of leads including a plurality of lead bottom surfaces, a plurality of conductive wires connecting the die and the plurality of leads, and an encapsulant material. The encapsulant material is transparent for visible wavelengths. The pad bottom surface is exposed without being covered by the encapsulant material, and the plurality of lead bottom surfaces each are exposed without being covered by the encapsulant material.
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