METHOD OF FABRICATING A STAMPER WITH MICROSTRUCTURE PATTERNS
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United States of America Patent
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Issued Date -
Aug 4, 2005
app pub date -
May 7, 2004
filing date -
Jan 29, 2004
priority date (Note) -
Abandoned
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Abstract
A method of fabricating a stamper with microstructure patterns includes providing a substrate, forming a first patterned layer on the substrate, forming a second patterned layer on the substrate for defining an edge of the stamper, and performing an electroforming process by taking the second pattern layer as a growth stop wall so as to form the stamper.
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