Area array packages with overmolded pin-fin heat sinks
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United States of America Patent
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N/A
Issued Date -
Jul 28, 2005
app pub date -
Jan 22, 2004
filing date -
Jan 22, 2004
priority date (Note) -
Abandoned
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Abstract
A semiconductor device has a semiconductor die (12) mounted to a leadframe (25). The semiconductor die is a power semiconductor device. A thermally conductive overmolding compound (22) is formed over the semiconductor die. The overmolding compound is made with a thermally conductive epoxy that conducts heat in the range of 2-5 watts/meter K. A pin-fin heat sink (24) is mounted to a top surface of the thermally conductive overmolding compound. The heat sink has a solid base (28) with a plurality of pin-fins (30) extending from the base. Scour lines (40) are cut in the base between the pin-fins. The heat generated by the semiconductor die is dissipated through the thermally conductive overmolding compound to the pin-fin heat sink.
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