Method of forming a mask pattern on a substrate
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United States of America Patent
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Issued Date -
Jul 21, 2005
app pub date -
Jan 14, 2005
filing date -
Jan 16, 2004
priority date (Note) -
Abandoned
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Abstract
A method of forming a two-dimensional mask pattern on a substrate (1). The method comprises: (a) printing a non-electrically conductive material (2) on a substrate in a coarse version of a desired mask pattern (3A-3D); and (b) selectively ablating a portion (3B) of the material using a laser to refine the coarse pattern to form the desired mask pattern.
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