System and method for measuring shrinkage behaviour and modulus change during solidification of a polymeric resin
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United States of America Patent
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N/A
Issued Date -
Jul 21, 2005
app pub date -
Mar 15, 2005
filing date -
Feb 15, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and a system for measuring the variation of volume and modulus during the solidification of a polymeric resin are provided, which use ultrasonic waves propagating through a sample and a coupling medium. On the one hand, the time of travel of the part of a signal that is reflected at the interface between the sample and the coupling medium back to the ultrasound transducer, gives the position of the interface between the sample and the coupling medium. This information may be used to determine the shrinkage of the sample. On the other hand, the time of travel of part of a signal that propagates through the thickness of the sample and then reflects from the bottom of the sample at the interface between the sample and a container in which it is contained may be used to determine the degree of stiffness of the sample. The time of travel is of the order of the microsecond and the change of thickness of the sample is of the order of a few hundred micrometers.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CONCORDIA UNIVERSITY | 1455 DE MAISONNEUVE BLVD WEST MONTREAL H3G 1M8 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hoa, Suong Van | Brossard, CA | 8 | 78 |
Ouellette, Paul | Montreal, CA | 5 | 34 |
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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