System and method for monitoring quality control of chemical mechanical polishing pads
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United States of America Patent
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Issued Date -
Jul 14, 2005
app pub date -
Dec 2, 2004
filing date -
Jan 13, 2004
priority date (Note) -
Abandoned
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Abstract
The present invention provides a method for predicting a performance characteristic of a chemical mechanical polishing (CMP) pad. The method comprises providing a CMP pad having a polishing surface and measuring a frictional property of the polishing surface. The method further includes estimating a performance characteristic of the CMP pad based on the frictional property. Other aspects of the present invention include a quality control system for monitoring chemical mechanical polishing pad performance.
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