Method of applying a cover layer to a structured base layer
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United States of America Patent
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Issued Date -
Jul 7, 2005
app pub date -
Dec 8, 2004
filing date -
Dec 8, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for applying a cover layer (1) to a base layer (2) which is provided with structuring (3) determined, for example, by printed conductors. The base layer (2) is moved continuously at a feed rate (v) in continuous operation. A guide (4) constructed as a rotatable body, brings the cover layer (1) to the matching feed rate (v) and applies the cover to the base layer (2). To optimize the application of the cover layer (1) to the structure (3) on the base layer (2), and in particular to prevent inaccuracies in the correlation between the cover layer (1) and the base layer (2) while at the same time permitting increased flexibility in manufacturing, the position of the structuring (3) is determined first by a non-contact sensor (5) immediately upstream of the guide (4). Then a signal for a laser (6) is triggered by a control unit (9). Depending on the position of the structuring (3), a recess is then created in the cover layer (1) by the laser (6), and the recess is thereafter made to correspond to the structuring (3).
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