Micro lead frame package having transparent encapsulant
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United States of America Patent
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Issued Date -
Jul 7, 2005
app pub date -
Jun 17, 2004
filing date -
Dec 31, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses an MLP having an optically transparent encapsulant. The MLP comprises a lead frame having a die-pad, a plurality of lead fingers and an interlock undercut. A die is placed onto the die-pad. A conductive wire is provided for connecting the die to the plurality of lead finger. The package is then encapsulated using optically transparent encapsulant.
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