Microstructure mold and method for coating the same

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United States of America Patent

APP PUB NO 20050142286A1
SERIAL NO

11023552

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microstructure mold according to the present invention has a self assembled monolayer formed of a surfactant on a surface thereof thereby not to impede a precision of the mold and simultaneously to have a proper releasing performance of a molding as well as to improve corrosion resistance thereof. Furthermore, it is advantageous to dramatically reduce processing costs by maintaining a uniform thickness of the monolayer without using a complex equipment.

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Patent Owner(s)

Patent OwnerAddress
LG MICRON LTDGYEONGBUK SOUTH KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwon, Hyouk Seoul, KR 20 138
Oh, Chang-Hoo Seoul, KR 1 1
Yee, Young-Joo Seongnam, KR 27 125

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  • 1 Citation Count
  • B05D Class
  • 4.43 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3645017579261684334801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475

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