Method and device for connecting molded parts

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United States of America Patent

SERIAL NO

10996928

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Abstract

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Molded parts are connected by means of an adhesive seam containing an adhesive capable of being hardened by heat. The molded parts (at least one of which is non-metallic) are inserted between a plurality of metal molds, with at least one metal mold having a groove along the region of the adhesive seam. The adhesive seam is applied, the metal molds and the molded parts are compressed, and the adhesive seam is heated by means of microwave energy from a microwave line contained in the groove of the metal mold.

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Patent Owner(s)

Patent OwnerAddress
SUSTECH GMBH & CO KGPETERSENSTRASSE 20 64287 DARMSTADT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elgimiabi, Sohaib Dreleich, DE 33 103
Groeger, Horst Kirchheim, DE 1 1
Hempelmann, Rolf St. Ingbert, DE 17 65
Sauer, Hans-Martin Darmstadt, DE 4 17
Spiekermann, Stefan Darmstadt, DE 18 58

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