Tension resistant structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050139975A1
SERIAL NO

11023926

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a tension resistant structure. The tension resistant structure includes a TCP/COF (tape carrier package/chip on film) tape having first and second sprocket holes formed at upper and lower ends of the TCP/COF tape while forming an interval of a predetermined pitch therebetween and supporters provided at both sides of the first and second sprocket holes of the TCP/COF tape so as to absorb tension being applied to the TCP/COF tape. The supporters are installed at both sides of the TCP/COF tape, so the TCP/COF tape made from Upilex/Kapton is prevented from being cut off while the TCP/COF tape is being fed or retrieved.

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Patent Owner(s)

Patent OwnerAddress
BOE HYDIS TECHNOLOGY CO LTDSAN 136-1 AMI-RI BUBAL-EUB ICHEON-SI KYOUNGKI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jung Han Kyoungki-do, KR 29 315

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