IC tag with sealing tool
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United States of America Patent
Stats
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N/A
Issued Date -
Jun 30, 2005
app pub date -
Dec 10, 2004
filing date -
Dec 25, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To provide an IC tag 11 permitting to easily attach the IC tag part to an article. An IC tag with a sealing tool wherein it is molded of synthetic resin in one body, and the tag part 11 with an embedded IC chip 12a is connected to the sealing tool 1 provided with a male part 5 having an insertion head part and a female part 6 having an insertion hole 6b to be engaged with the insertion head part 5 at both end parts of filament parts 3, 4, respectively, through a connection part 9 which can be manually separated.
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