Sputtering device
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United States of America Patent
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Issued Date -
Jun 30, 2005
app pub date -
Dec 7, 2004
filing date -
Dec 24, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sputtering device according to this invention can sputter a plurality of substrates and can vary an angle of incidence of sputtering particles to each substrate, and comprises at least a substrate holder provided in a vacuum chamber rotatably; a plurality of substrates installed on said substrate holder; a target for forming a thin film on said substrates; and a rotatable sputtering cathode installing said target; wherein a center axis of said target is eccentric to a rotation shaft of said sputtering cathode in order to gain a desired film forming distribution.
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