Etching solution composition for metal films
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United States of America Patent
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Issued Date -
Jun 23, 2005
app pub date -
Dec 2, 2004
filing date -
Dec 3, 2003
priority date (Note) -
Abandoned
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Abstract
The present invention aims to provide an etching solution composition which enables to etch a metal film in a controllable manner, form a desired definite tapered shape, and obtain a smooth surface without causing etching solution exudation trace. Said problems have been solved by the present invention, which is an etching solution composition for etching metal films containing one or more surfactants selected from the group consisting of alkyl sulfate or perfluoroalkenyl phenyl ether sulfonic acid and the salts thereof.
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