LED package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 16, 2005
app pub date -
Jan 21, 2004
filing date -
Dec 16, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An improved LED package comprises a first stand, a second stand, an LED chip, an epoxy packaging object, wherein the first stand further comprises a concave bowl section, and a first pin is extended from the bottom of the first stand, and a second stand is disposed adjacent to the first stand and keeps a certain distance from the first stand. The LED chip is disposed in the bowl section at the top of the first stand, and the anode of the LED chip makes use of a conductive metal wire to electrically connect the second stand. The epoxy packaging object encapsulates the first stand, second stand, and LED chip inside and just leaves the first and second pins exposed. A plane perpendicular to the optical path of the light emitted by the LED chip is disposed on the top surface of the packaging object, and the top surface has more than one circular protrusion to achieve the objective of enhancing the brightness and uniformity of luminescence.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully