Plating method, plating apparatus and a method of forming fine circuit wiring
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United States of America Patent
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Issued Date -
Jun 16, 2005
app pub date -
Nov 4, 2004
filing date -
Nov 7, 2003
priority date (Note) -
Abandoned
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Abstract
A copper plating film has a lower chlorine ion content. Circuit wiring of high electromigration resistance is formed by electroplating. In a method of copper plating using a leveler containing a nitrogen-containing high molecular compound, the leveler is dechlorinated prior to its use for plating. A plating apparatus has a tank for preparing a plating solution, a device for dechlorinating a leveler, a leveler supply station for supplying the dechlorinated leveler to the tank and a plating station. A method of forming fine circuit wiring includes forming a circuit with a phosphorus-doped copper plating layer on a substrate for an electronic circuit having a fine circuit pattern, a barrier layer and any necessary seed layer formed thereon.
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