Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor
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United States of America Patent
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Issued Date -
Jun 16, 2005
app pub date -
Nov 4, 2004
filing date -
Nov 4, 2003
priority date (Note) -
Abandoned
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Abstract
The invention provides methods for CMP polishing, residue removal and post-CMP polishing of a metal containing substrate. The CMP polishing methods for contacting a metal-containing substrate with a composition comprising an oxider, a salicylic acid compound, water, and an abrasive. The post-CMP polishing and residue removal methods require contacting a metal-containing substrate with a composition comprising an oxidizer, a salicylic acid compound, and water.
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