Temperature control system for solder handling devices and method for temperature control for those devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050121495A1
SERIAL NO

10859936

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

In a temperature control system for controlling a heating member or means of a solder handling device, a plurality of solder handling devices such as soldering iron, a heater tweezer, a solder sucker and a hot air blower are selectively coupled with a temperature controller which in turn identify the solder handling device connected thereto and controls temperature of the heater of the connected device with temperature control characteristic suitable for the device. Each solder handling device may have a resistor of which resistance value represents the type of the device so that the temperature controller identify the device by the resistance value.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HAKKO CORPORATION4-5 SHIOKUSA 2-CHOME NANIWA-KU OSAKA CITY OSAKA 556-0024

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yokoyama, Tetuo Hannan-shi, JP 1 14

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation