Electrolytic plating method and device for a wiring board
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United States of America Patent
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app pub date -
Jul 22, 2004
filing date -
Mar 22, 2000
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Abandoned
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Abstract
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
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