Method for cleaning substrate and apparatus therefor

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United States of America Patent

SERIAL NO

11037980

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Abstract

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A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a throughput. A substrate such as a wafer or the like placed in a cleaning tank filled therein with a cleaning liquid is cleaned by an ultrasonic vibration. Cleaning of the substrate is carried out in such a manner that an ultrasonic vibration is applied to the substrate from a bottom of the cleaning tank, during which application the substrate is kept at a predetermined inclination angle with respect to a direction of acoustic streaming in the cleaning liquid formed by propagation of an ultrasonic wave.

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Patent Owner(s)

Patent OwnerAddress
KAIJO CORPORATIONHAMURA-SHI TOKYO 205-8607

International Classification(s)

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  • 2005 Application Filing Year
  • B08B Class
  • 559 Applications Filed
  • 304 Patents Issued To-Date
  • 54.39 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2005200620072008200920102011201220132014201520162017201820190255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okano, Shoichi Tokyo, JP 4 85
Takahashi, Norihisa Tokyo, JP 12 105

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  • 4 Citation Count
  • B08B Class
  • 3.13 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1120274261271123301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 90100 +0102030405060708090100110120130140150160170180190200210220

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