Adjustable gap chemical mechanical polishing method and apparatus
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United States of America Patent
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Issued Date -
Jun 2, 2005
app pub date -
Jul 6, 2004
filing date -
Jul 3, 2003
priority date (Note) -
Abandoned
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Abstract
A polishing apparatus for polishing a surface of wafer is provided. The apparatus includes a carrier to hold the workpiece. An array of fluid nozzles are placed across from the surface of the wafer to provide a gap between the nozzles and the surface of the workpiece. A polishing pad positioned within the gap and configured to polish the surface of the workpiece when a fluid is applied from the plurality of nozzles to push the polishing pad to the surface.
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