Method for preparing gas-tight terminal
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United States of America Patent
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Issued Date -
Jun 2, 2005
app pub date -
Jul 29, 2004
filing date -
Jan 31, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An object of the present invention is to provide a low-priced and highly reliable high-vacuum hermetic seal package. To this end, a method of manufacturing a hermetic seal package according to the present invention is a method of manufacturing a hermetic seal package by anodically bonding an opening of a cylindrical body for forming an outer frame and the outer edge of a flat glass plate to each other, characterized in that anodically bonded surfaces are 0.04 mm to 200 mm in width and not more than 0.20 .mu.m in surface roughness, the cylindrical body consists of a metal consisting of at least one of Fe, Ni and Co or an alloy or conductive ceramics mainly composed of this metal, the glass plate contains alkaline metal ions, and the quantity of inert gas permeation on bonded portions is 1.0.times.10.sup.-15 Pa.m.sup.3/s to 1.0.times.10.sup.-8 Pa.m.sup.3/s after anodic bonding.
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