Laser ablation resistant copper foil
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United States of America Patent
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app pub date -
Feb 11, 2004
filing date -
Dec 5, 2002
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Abandoned
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Abstract
A copper foil for lamination to a dielectric substrate iscoated with a laser ablation inhibiting layer having an average surface roughness of less than 0.7 micron and an average nodule height of less than 0.75 micron that is effective to provide a lamination peel strength to FR-4 of at least 4.5 pounds per inch. The foil is typically laminated to a dielectric substrate, such as glass reinforced epoxy or polyimide and imaged into a plurality of circuit traces. Blind vias may be drilled through the dielectric terminating at an interface between the foil and the dielectric. The coated foil of the invention resists laser ablation, thereby resisting piercing of the foil by the laser during drilling.
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