Sputtering apparatus
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United States of America Patent
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Issued Date -
May 26, 2005
app pub date -
Oct 25, 2004
filing date -
Oct 28, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sputtering apparatus for applying a thin film coating to a substrate containing, in a vacuum chamber, at least two cylindrical targets and at least two magnets each juxtaposed to one of the targets so as to generate a magnetic field in a vicinity of an outer surface of the target, wherein, the following relationship is satisfied d1.ltoreq.3d2, provided that d1 is a distance between the outer surfaces of the two targets and d2 is any one of distances between the outer surfaces of the targets and the substrate.
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