COMPACT, HIGH Q INDUCTOR FOR INTEGRATED CIRCUIT
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United States of America Patent
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Issued Date -
May 19, 2005
app pub date -
Nov 19, 2003
filing date -
Nov 19, 2003
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Abstract
An inductor for an integrated circuit made of a plurality of stacked, electrically coupled, metal layers. Each metal layer includes an inductor formed of a spiral pattern, which except for the top and bottom inductors, are electrically coupled to the spiral inductor formed on the metal layer above and below with an electrical path or via formed between each metal layer. The top and bottom inductors are electrically coupled to the inductor directly below and above, respectively.
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