Rotating sputtering magnetron

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United States of America Patent

PATENT NO 7182843
APP PUB NO 20050103619A1
SERIAL NO

10982616

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.

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Patent Owner(s)

Patent OwnerAddress
DEXTER MAGNETIC TECHNOLOGIES INC48460 KATO ROAD FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Chun Plainview, NY 158 1857
Padua, Christopher Campbell, CA 1 6
Stelter, Richard Buford, GA 2 7
Welk, Aron Tracy, CA 4 8

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