Mass production method for three-dimensional micro structure having high aspect ratio
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United States of America Patent
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Issued Date -
May 12, 2005
app pub date -
Feb 23, 2004
filing date -
Nov 6, 2003
priority date (Note) -
Abandoned
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Abstract
The present invention relates to mass production method for three-dimensional micro structure and especially to the mass production method for three-dimensional metal micro structure having high aspect ratio. According to the present invention, the manufacturing of the three-dimensional micro structure having high aspect ratio is possible, which was impossible with the prior art of MEMS or LIGA. Especially, micro structure with complex shape can be obtained through dividing into layers and depositing the layers. Micro structure with any shape can be obtained with the method according to the present invention.
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