System and method for defect free conductor deposition on substrates
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United States of America Patent
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Issued Date -
May 5, 2005
app pub date -
Nov 1, 2004
filing date -
Oct 31, 2003
priority date (Note) -
Abandoned
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Abstract
A system and method for depositing a defect-free conductor on semiconductor substrates having features and seed layers with defective regions. A repair layer is deposited over the seed layer and the defective regions in a deposition module within a housing. The repair layer can be deposited by atomic layer deposition or chemical vapor deposition. A conductive material is then electroplated over the seed layer to fill the features and form a defect-free conductive layer over the top surface of the substrate. The electroplating is performed in another deposition module within the housing.
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