Semiconductor manufacturing apparatus, semiconductor manufacturing method and wafer stage
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United States of America Patent
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Issued Date -
May 5, 2005
app pub date -
Oct 29, 2004
filing date -
Oct 29, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A stage main body of a wafer stage having electrostatic chuck function is sectioned into plural chucking areas with partition members. Each chucking area includes electrodes capable of changing an applied voltage, a helium supply pipe and a fluorescent thermometer. The distribution of the temperature of a wafer is grasped at real time by measuring the temperature of the wafer corresponding to the plural chucking areas. A local temperature correction for the wafer is carried out by adjusting the electrostatic chucking force in the chucking area corresponding to a necessary temperature corrective area. By achieving the temperature control within the wafer surface in this way, the equality in wafer processing, which is affected by the wafer temperature, is secured thereby eliminating the inequality in processing accuracy of the wafer processing within a wafer surface.
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