Polish pad tool

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050088001A1
SERIAL NO

10693089

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A tool for lifting a pad, such as a CMP polish pad, is provided that includes a jaw that has an upper jaw portion and a lower jaw portion. The lower jaw portion has a sloped upper surface for slidably receiving a portion of the pad. A first member is pivotally coupled to the jaw. A second member is pivotally coupled to the first member. The second member has a surface opposite to the sloped surface of the lower jaw portion. The surface is operable to clamp the portion of the pad against the sloped surface when the first member is pivoted upwards.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG AUSTIN SEMICONDUCTOR LLC1209 ORANGE STREET WILMINGTON NEW CASTLE COUNTY DE 19801

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jones, Kelley Rockdale, TX 1 0

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