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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
BOXX TECHNOLOGIES LLC	10435 BURNET ROAD # 120 AUSTIN TX 78758

International Classification(s)

• G06F:ELECTRIC DIGITAL DATA PROCESSING

• 2004 Application Filing Year
• G06F Class
• 27698 Applications Filed
• 17046 Patents Issued To-Date
• 61.55 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hester, Victor P	El Cajon, CA	10	365
# of filed Patents : 10 Total Citations : 365
Smith, John V	Poway, CA	11	409
# of filed Patents : 11 Total Citations : 409
Wylie, William A	San Diego, CA	7	326
# of filed Patents : 7 Total Citations : 326

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Patent Citation Ranking

• 26 Citation Count
• G06F Class

• 52.46 % this patent is cited more than
• 17 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 02, 2008	US,7420805,B2   US7420805B2	GRANTED PATENT AS SECOND PUBLICATION
April 21, 2005	US,20050083651,A1   US20050083651A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2016/0380,173

LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount

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Abstract

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A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove. An LED chip, which has a bottom substrate, is mounted on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers. Glue is filled along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.

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Description

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Claims

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Claims data not available

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