Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereof
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United States of America Patent
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Issued Date -
Apr 7, 2005
app pub date -
Jun 17, 2004
filing date -
Oct 7, 2003
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Abandoned
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Abstract
A method for manufacturing the light emitting diode utilizing the metal substrate and the metal bonding technology is provided. The method includes steps of providing a growing substrate, forming a multi-layered semiconductor structure on the growing substrate, bonding a metal substrate to the multi-layered semiconductor structure, removing the growing substrate, and forming a first electrode and a second electrode on the multi-layered semiconductor structure and the metal substrate respectively.
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