Target manipulation for pulsed laser deposition
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United States of America Patent
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Issued Date -
Mar 31, 2005
app pub date -
Sep 25, 2003
filing date -
Sep 25, 2003
priority date (Note) -
Abandoned
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Abstract
In a method and apparatus for pulsed laser deposition, a target is eroded more uniformly by employing a two-stage laser scanning process. In a first stage, a pulsed laser strikes the target along an x/y scan pattern across the surface of the target while the target is rotationally fixed. In a second stage, the target is rotated by an incremental angle. These two stages are continuously repeated in sequence throughout the pulsed laser deposition process.
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