Multilayer heat sealant structures, packages and methods of making the same
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United States of America Patent
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Issued Date -
Mar 17, 2005
app pub date -
Sep 17, 2003
filing date -
Sep 17, 2003
priority date (Note) -
Abandoned
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Abstract
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.
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