Optical element, optical element wafer, and manufacturing methods for the same

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United States of America Patent

APP PUB NO 20050048267A1
SERIAL NO

10443082

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Abstract

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The present invention provides an optical element, an optical element wafer and a method of manufacturing the same. The optical element comprises a optical film adhered on an substrate of the optical element. The method for manufacturing the optical element wafer comprising the steps of dividing a base material of a optical film into a plurality of optical films, separating the optical film base material by removing sections where no optical film is to be formed, adhering the divided optical films on the substrate base material, and a plurality of optical elements are obtained by dividing the substrate base material with the optical film adhered on one surface of the individual substrate.

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Patent Owner(s)

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TOMOEGAWA PAPER CO LTD5-15 KYOBASHI 1-CHOME CHUO-KU TOKYO 104-8335

International Classification(s)

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  • 2003 Application Filing Year
  • B32B Class
  • 4674 Applications Filed
  • 1705 Patents Issued To-Date
  • 36.48 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances200320042005200620072008200920102011201220132014201520160255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aikawa, Fuminori Shizuoka-shi, JP 2 10
Komagata, Fumiki Shimada-shi, JP 6 17
Tezuka, Akira Shizuoka-shi, JP 14 126
Tsuchida, Masayuki Shizuoka-shi, JP 14 268

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  • B32B Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6494946620510041232013772701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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