Digital image capturing module assembly and method of fabricating the same
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United States of America Patent
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N/A
Issued Date -
Mar 3, 2005
app pub date -
Aug 29, 2003
filing date -
Aug 29, 2003
priority date (Note) -
Abandoned
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Abstract
A digital image capturing module assembly and method of fabricating the same is proposed, which is used to fabricate a digital image capturing module assembly from a photosensitive printed circuit board and a lens holder. The proposed assembly method is characterized by the attachment of a light-impenetrable reinforcement plate to the photosensitive printed circuit board to provide both a light-impenetrable effect and an reinforcement effect to the photosensitive printed circuit board, which allows the enclosed photosensitive device to be shielded from sidelight and backlight, and further allows the photosensitive printed circuit board to be reinforced in structural strength that can prevent it from deformation or cracking during fabrication and transportation. This feature allows the finished product of digital image capturing module to be more assured in its optical quality of captured images during actual application, and also allows the fabrication thereof to have a high rate of yield during assembly.
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