Electronic package with insert conductor array
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United States of America Patent
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N/A
Issued Date -
Mar 3, 2005
app pub date -
Aug 31, 2004
filing date -
Sep 3, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package for an electronic component includes an enclosure that defines a cavity and electrically conductive bodies that extend through a dielectric substrate that forms at least a portion of at least one side of the enclosure, each of the conductive bodies offering accessible electrical contact surfaces on opposite sides of the dielectric substrate. The dielectric material in the enclosed can be partially or entirely formed via injection molding.
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