Process and system for cleaning surfaces of semiconductor wafers
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United States of America Patent
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Issued Date -
Feb 24, 2005
app pub date -
Aug 19, 2003
filing date -
Aug 19, 2003
priority date (Note) -
Abandoned
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Abstract
A process for cleaning the surface of a semiconductor wafer. The process has the following steps: a) conveying a component selected from the group consisting of a dense gas component, a liquid component and a mixture thereof to a bellows accumulator having a bellows therein; b) applying an elevated pressure to said bellows sufficient to discharge the component from the bellows onto said surface of the wafer; and c) contacting the component with the surface of the wafer. There is also a system for cleaning the surface of a semiconductor wafer and for mixing a dense gas component and a liquid component.
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