Inspection and metrology module cluster tool
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United States of America Patent
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Issued Date -
Feb 17, 2005
app pub date -
Jul 14, 2004
filing date -
Jul 14, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor inspection tool includes a robot, a first wafer carrier proximate the robot, a first wafer inspection module proximate the robot, a second wafer inspection module proximate the robot, and a controller configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module.
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