Magnetron sputtering device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 17, 2005
app pub date -
Oct 4, 2004
filing date -
Nov 7, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A target arrangement for use within a vacuum sputtering zone comprising: a primary target (1) comprising material to be sputtered and an auxiliary target (2) of ferromagnetic material, the targets being located relative to one another such that upon application of a magnetic field across the surface of the targets, the magnetic field over the primary target is confined into an area of high homogeneous magnetic field strength substantially parallel to the surface of the primary target, to achieve uniform erosion across said area of target during sputtering. Preferably the primary target and auxiliary target are spaced apart by a gap (12), to enhance the confinement of magnetic field. The auxiliary target may have a surface which is raised beyond a surface of the primary target. The primary target may be of ferromagnetic or non-magnetic material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully