Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire
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United States of America Patent
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app pub date -
Sep 17, 2004
filing date -
Mar 19, 2002
priority date (Note) -
Abandoned
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Abstract
Disclosed is a linear evaporation source used for forming a thin film for an organic semiconductor device, the linear evaporation source comprising a crucible having a receiving space formed therein, for accommodating an evaporation material and an opening section formed at one side of the crucible in a length direction, wherein the opening section becomes narrow as it travels from both ends to a center portion thereof. If the thin film is formed using the linear evaporation source, a low material use rate of the vacuum evaporation source for the formation of the thin film is improved, thickness uniformity of the deposited thin film throughout the whole area is secured, and shadow effect due to the shadow mask is improved.
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