Heat dissipating device for dissipating heat generated by an electronic component inside a housing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 10, 2005
app pub date -
Nov 21, 2003
filing date -
Aug 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a heat dissipating device, a heat-conducting unit is disposed in a housing and has a first heat-conducting member mounted on a circuit board inside the housing and contacting and in thermal communication with an electronic component mounted on the circuit board, and a second heat-conducting member that has a first end portion connected to the first heat-conducting member, and a second end portion opposite to the first end portion and extending outwardly of the housing through a through hole in the housing. A heat-dissipating fin module is mounted externally of the housing, and has a base plate connected to and in thermal communication with the second end portion of the second heat-conducting member, and a plurality of fin posts mounted fixedly and spacedly on and in thermal communication with the base plate.
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