Method of making a thin die to be used in a press
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 10, 2005
app pub date -
Jul 16, 2004
filing date -
Jul 17, 2003
priority date (Note) -
Abandoned
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
Disclosed is a thin die adapted to be used in a press. The die disclosed herein includes a base or backing portion that provides rigidity to the die assembly. The base includes an indentation defining a boarder around the peripheral edge of the base. A thin die is housed in the indentation of the base and the thin die is adhered to the indentation of the base by an adhesive. The thin die is positioned in the indentation of the base so that raised portions of the thin die are facing away from the indentation in the base to allow the thin die to cut into a sheet material. Ejection foam is adhered to the raised portion side of the thin die by an adhesive so that the ejection foam protects the raised portion of the thin die and provides an ejection means of the cut shape out of the sheet material. Also disclosed is a die and press system utilizing the thin die disclosed herein. Included in the system is a die press, which may be a platen die press or a roller die press. The die press includes a cutting pad that allows the die to cut through the sheet material and into the cutting pad, if a platen die press is used. The system further includes a thin die adapted to be used with a die press. The thin die includes a base portion, a thin die portion, and an ejection foam portion, wherein the base portion and the ejection foam portion sandwich the thin die portion so that the thin die is located in an indentation located in the base and is adhered to the base by an adhesive. Further, the ejection foam portion is adhered to the thin die portion so as to protect raised portions of the thin die portion. The ejection foam protects the raised portions of the thin die portion and acts as an ejection means to eject the cut shapes from the sheet material.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ELLISON EDUCATIONAL EQUIPMENT INC | LAKE FOREST CA 92630 |
International Classification(s)

- 2004 Application Filing Year
- B21K Class
- 129 Applications Filed
- 51 Patents Issued To-Date
- 39.54 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hughes, David L | Rancho Santa Margarita, CA | 20 | 79 |
# of filed Patents : 20 Total Citations : 79 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 5 Citation Count
- B21K Class
- 8.82 % this patent is cited more than
- 20 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
