Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides
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United States of America Patent
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Issued Date -
Feb 3, 2005
app pub date -
Aug 10, 2004
filing date -
Feb 23, 1999
priority date (Note) -
Abandoned
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Abstract
The methods involve using a tool to cut or form multiple optical element shaped cavities in a surface of a substrate without rotating the tool or substrate during the cutting or forming process. At least some of the cavities are cut or formed to have at least two surfaces that come together to form a ridge and that are quite small relative to the length and width of the substrate. Thereafter the substrate is used to form optical films, components or wave guides having multiple optical elements on at least one surface corresponding to the cavities in the substrate.
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