Substrate treatment apparatus, substrate treatment method and substrate manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050022930A1
SERIAL NO

10813926

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Above a substrate mounted on rollers, an upper board is prepared a predetermined distance apart from the substrate. A pipe fills a space between the upper board and the substrate with washing water by supplying the washing water at a predetermined flow rate. A washing water layer is formed evenly on an upper surface of the substrate when the substrate passes below the upper board. Below the substrate, a lower board is prepared a predetermined distance apart from the substrate. A pipe fills a space between the lower board and the substrate with the washing water by supplying the washing water at a predetermined flow rate. A washing water layer is formed evenly on a lower surface of the substrate when the substrate passes above the lower board. The air emitted from an air knife is sprayed to the upper/lower surface of the substrate slantingly at a predetermined incident angle in an opposite direction of a substrate moving direction. The washing water is pushed away and removed from the upper/lower surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishida, Takahisa Hadano-shi, JP 7 178
Izaki, Ryo Kanagawa-ken, JP 2 10
Kamaishi, Takao Hadano-shi, JP 1 7
Moriguchi, Yoshihiro Hiratsuka-shi, JP 6 60
Yasuike, Yoshitomo Kanagawa-ken, JP 2 13

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