ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE
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United States of America Patent
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app pub date -
Jan 29, 2004
filing date -
Jan 29, 2004
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Abstract
Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of one-Gigabyte, two-Gigabyte, and four-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in the first row on a first lateral portion of the printed circuit board and in the second row on the first lateral portion are connected to a first addressing register with two register integrated circuits. The integrated circuits in the first row on the second lateral portion and in the second row on the second lateral portion are connected to a second addressing register with two register integrated circuits. Each addressing register processes a non-contiguous subset of the bits in each data word.
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