Methods for enclosing a thermoplastic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 27, 2005
app pub date -
Aug 18, 2004
filing date -
Jan 29, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A circuit package for housing semiconductor or other integrated circuit devices ('die') includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. A lid is welded to the frame after a die is attached to the flange.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully