Thermal paste for improving thermal contacts
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United States of America Patent
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Issued Date -
Jan 27, 2005
app pub date -
Mar 23, 2004
filing date -
Jul 9, 2003
priority date (Note) -
Abandoned
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Abstract
A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed.
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